Wydarzenia IEEE WIE AG

 

IEEE Women in Engineering na MIKON 2020 - 5.10.2020

 

IEEE Day 29.09.2020 - Sesja WIE PL

"Computer multiphysics simulations - a must-have for emerging technologies", dr Marzena Olszewska-Placha

 

 

 

Distinguished Microwave Lecturers

 

Zaproszenie od Przewodniczącego IEEE MTT-S MGA Prof. Nuno Borges Carvalho do bezpłatnego udziału w wykładach Distinguished Microwave Lecturers

IEEE Microwave Theory and Techniques Society (MTT-S) co roku dokonuje starannego wyboru kilku wybitnych wykładowców (Distinguished Microwave Lecturers - DML), będących ekspertami i liderami technologicznymi w swoich dziedzinach, w obszarze zainteresowań MTT-S. Każdy DML sprawuje swoją funkcję ambasadora MTT-S przez okres trzech lat, wygłaszając swój wykład wielokrotnie w różnych częściach świata, na zaproszenie lokalnych Oddziałów (Chapterów) MTT-S, które pokrywają lokalne koszty oraz odpowiadają za należytą promocję wydarzenia w swoim środowisku.

W imieniu przewodniczącego IEEE MTT-S MGA serdecznie zapraszamy do udziału w wykładach Distinguished Microwave Lecturers Class 2019, 2020. Z powodu pandemii COVID-19 wybrane wykłady DML w najbliższym czasie będą odbywały się w formie zdalnej, umożliwiającej interakcję w wirtualnej sali wykładowej. Udział w wykładach jest otwarty i bezpłatny dla wszystkich zainteresowanych, wymaga jednak wcześniejszej rejestracji.

Informacja i rejestracja:

https://www.mtt.org/mtt-s-covid-19-update/

 

Wykładowcy i ich wykłady:

 

Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities

Wykładowca: Payam Heydari, University of California, Irvine

Abstract

The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of "Beyond-5G" (e.g., 6G) technology.  This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.

 

Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari's research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers. He has given several Keynote Speech and tutorials to international forums and conferences. He was a Distinguished Lecturer of the IEEE Solid-State Circuits Society (Jan. 2014 - Jan. 2016), and is now a Distinguished Microwave Lecturer of the IEEE Microwave Theory and Techniques Society (Jan. 2019 – Dec. 2022). His group was among the first who introduced the design of millimeter-wave integrated circuits in silicon technologies. They demonstrated the world’s first fundamental frequency CMOS transceiver operating above 200 GHz, the world’s highest radiated power and highest efficiency sub-terahertz circularly-polarized radiator in silicon employing a multi-port cavity-backed structure.

Dr. Heydari was selected as the inaugural Faculty Innovation Fellow by the University of California, Irvine (UCI) Beall Applied Innovation. He is the recipient of a number of awards including the 2017 UCI’s School of Engineering Mid-Career Excellence in Research, the 2010 Faculty of the Year Award from UC-Irvine's Engineering Student Council (ECS), the 2009 School of Engineering Best Faculty Research Award, the 2007 IEEE Circuits and Systems Society Guillemin-Cauer Award, the 2005 IEEE Circuits and Systems Society Darlington Award, and the 2005 National Science Foundation (NSF) CAREER Award.

Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.

 

Microwaving a Biological Cell Alive ‒ Broadband Label-free Noninvasive Electrical Characterization of a Live Cell

Wykładowca: James C. M. Hwang, Cornell University

Abstract

Microwave is not just for cooking, smart cars, or mobile phones. We can take advantage of the wide electromagnetic spectrum to do wonderful things that are more vital to our lives. For example, microwave ablation of cancer tumor is already in wide use, and microwave remote monitoring of vital signs is becoming more important as the population ages. This talk will focus on a biomedical use of microwave at the single-cell level. At low power, microwave can readily penetrate a cell membrane to interrogate what is inside a cell, without cooking it or otherwise hurting it. It is currently the fastest, most compact, and least costly way to tell whether a cell is alive or dead. On the other hand, at higher power but lower frequency, the electromagnetic signal can interact strongly with the cell membrane to drill temporary holes of nanometer size. The nanopores allow drugs to diffuse into the cell and, based on the reaction of the cell, individualized medicine can be developed and drug development can be sped up in general. Conversely, the nanopores allow strands of DNA molecules to be pulled out of the cell without killing it, which can speed up genetic engineering. Lastly, by changing both the power and frequency of the signal, we can have either positive or negative dielectrophoresis effects, which we have used to coerce a live cell to the examination table of Dr. Microwave, then usher it out after examination. These interesting uses of microwave and the resulted fundamental knowledge about biological cells will be explored in the talk.

Bio

James HwangJames Hwang  is Professor in the Department of Materials Science and Engineering at Cornell University. He graduated from the same department with a Ph.D. degree. After years of industrial experience at IBM, Bell Labs, GE, and GAIN, he spent most of his academic career at Lehigh University. He cofounded GAIN and QED; the latter became the public company IQE. Between 2011 and 2013, he was the Program Officer for GHz-THz Electronics at the U.S. Air Force Office of Scientific Research. He has been a visiting professor at Cornell University in the US, Marche Polytechnic University in Italy, Nanyang Technological University in Singapore, National Chiao Tung University in Taiwan, Shanghai Jiao Tong University, East China Normal University, and University of Science and Technology in China. He is an IEEE Life Fellow and a Distinguished Microwave Lecturer. He has published more than 350 refereed technical papers and been granted eight U.S. patents. He has researched for decades on the design, modeling and characterization of optical, electronic, and micro-electromechanical devices and circuits. His current research interest focuses on electromagnetic sensors for individual biological cells, scanning microwave microscopy, and two-dimensional atomic-layered materials and devices.

 

Chip-Scale Wave-Matter Interactions at RF-to-Light Frequencies: Circuits, Systems and Applications

Wykładowca: Dr. Ruonan Han, MIT

Abstract

Traditional electromagnetic (EM) spectral sensors using integrated circuit technologies (e.g. automotive radars, security imagers, cameras, etc.) are normally based on remote wave scattering or absorption by macroscopic objects at remote distance; the operations are also not selective in wave frequencies. In the past couple of years, a new paradigm of chip-scale EM spectral sensing emerges with features complementary to the above: they utilize various modalities of interactions between EM waves with high-precision frequency control and microscopic particles (molecules, atoms, etc.) with close proximity to the chip. This progress is enabled by the recent advances of silicon devices and processes, as well as the extension of circuit operation frequencies into the terahertz regime. Chip-scale sensing and metrology systems with new capabilities, higher performance and unprecedented affordability now become possible. Examples include THz gas spectroscopy sensors, on-chip “atomic-clock-grade” frequency references, room-temperature CMOS-quantum magnetometers, etc. This talk will present the basic physics of the some wave-matter interactions, key enabling technologies, as well as the designs and prototypes of a few chip systems in the category described above. We will also discuss their potential applications in bio-chemical analysis, wireless networks, PNT (positioning, navigation & timing), security and so on.

Bio

Ruonan HanRuonan Han  received the B.Sc. degree in microelectronics from Fudan University, in 2007, the M.Sc. degree in electrical engineering from the University of Florida in 2009, and the Ph.D. degree in electrical and computer engineering from Cornell University in 2014. He has been with the Department of Electrical Engineering and Computer Science, MIT, since July 2014, and is now an associate professor. His research group at MIT focuses on RF-to-photonics integrated circuits and systems for spectroscopy, metrology, imaging, quantum sensing/processing, broadband/secure communication, etc. He was the recipient of the Cornell ECE Directors Ph.D. Thesis Research Award, Cornell ECE Innovation Award, and two Best Student Paper Awards of the IEEE Radio-Frequency Integrated Circuits Symposium (2012 and 2017). He was also the recipient of the IEEE Microwave Theory and Techniques Society (MTT-S) Graduate Fellowship Award, and the IEEE Solid-State Circuits Society (SSC-S) Predoctoral Achievement Award. He is an associate editor of IEEE Transactions on Very-Large-Scale Integration System, a guest associate editor of IEEE Transactions on Microwave Theory and Techniques (2019), and also serves on the Technical Program Committee (TPC) of IEEE RFIC Symposium and the Steering Committee and TPC of IEEE International Microwave Symposium. He is the IEEE MTT-S Distinguished Microwave Lecturer (2020-­‐2022). He won the Intel Outstanding Researcher Award in 2019 and the National Science Foundation (NSF) CAREER Award in 2017.